There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.
According to our (Global Info Research) latest study, the global Test & Burn-in Socket market size was valued at USD 1268 million in 2022 and is forecast to a readjusted size of USD 2066.3 million by 2029 with a CAGR of 7.2% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The main Test & Burn-in Socket players include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, etc. The top 5 Test & Burn-in Socket players account for approximately 40% of the total global market. Asia-Pacific is the largest consumer market accounting for about 62%, followed by North America and Europe. In terms of Type, test socket is the largest segment, with a share about 60%. And in terms of application, the largest application is SOC, CPU, GPU, etc, followed by memory.
For more information (Including Full TOC, List of Tables & Figures, Chart), please click @ https://www.globalinforesearch.com/reports/1002890/test---burn-in-socket
This report is a detailed and comprehensive analysis for global Test & Burn-in Socket market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Market segment by Type
Burn-in Socket
Test Socket
Market segment by Application
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other Non-Memory
Major players covered
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
MJC
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Test & Burn-in Socket product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Test & Burn-in Socket, with price, sales, revenue and global market share of Test & Burn-in Socket from 2018 to 2023.
Chapter 3, the Test & Burn-in Socket competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Test & Burn-in Socket breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Test & Burn-in Socket market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Test & Burn-in Socket.
Chapter 14 and 15, to describe Test & Burn-in Socket sales channel, distributors, customers, research findings and conclusion.
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