Showing posts with label HTCC Package market. Show all posts
Showing posts with label HTCC Package market. Show all posts

Friday, April 14, 2023

Global HTCC Package Industry Market Report 2023-2029

 HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.

According to our (Global Info Research) latest study, the global HTCC Package market size was valued at USD 2861.5 million in 2022 and is forecast to a readjusted size of USD 4465.8 million by 2029 with a CAGR of 6.6% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Global main manufacturers of HTCC package include Kyocera, Sinopack & CETC 13, NGK/NTK, etc. The top three players hold a share about 80%. Japan is the largest production area, has a share about 70%, followed by China and North America, with share 24% and 3%, separately. The largest market is Asia Pacific, holds a share about 89%, followed by North America and Europe, with around 7% and 2% market share respectively.

This report is a detailed and comprehensive analysis for global HTCC Package market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

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This report profiles key players in the global HTCC Package market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kyocera, Maruwa, NGK/NTK, Egide and NEO Tech, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Major players covered
Kyocera
Maruwa
NGK/NTK
Egide
NEO Tech
AdTech Ceramics
Ametek
Electronic Products, Inc. (EPI)
SoarTech
CETC 43 (Shengda Electronics)
Jiangsu Yixing Electronics
Chaozhou Three-Circle (Group)
Hebei Sinopack Electronic Tech & CETC 13
Beijing BDStar Navigation (Glead)
Fujian Minhang Electronics
RF Materials (METALLIFE)
CETC 55
Qingdao Kerry Electronics
Hebei Dingci Electronic
Shanghai Xintao Weixing Materials
Shenzhen Zhongao New Porcelain Technology
Hefei Euphony Electronic Package
Fujian Nanping Sanjin Electronics
Shenzhen Cijin Technology

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe HTCC Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of HTCC Package, with price, sales, revenue and global market share of HTCC Package from 2018 to 2023.
Chapter 3, the HTCC Package competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the HTCC Package breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and HTCC Package market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of HTCC Package.
Chapter 14 and 15, to describe HTCC Package sales channel, distributors, customers, research findings and conclusion.

Research Data Source:

Primary and secondary research as two components of methodology applied: Primary research is based on online and telephone based survey, i.e. interviews with several key experts with different functions in the market – from industry, trade and customers, associations and external experts such as researchers. Secondary research is based on all kinds of publicly or commercially available sources, such as publications and further information published from industry (annual reports, company websites, press releases, industry journals and trade publications), relevant databases (government, patent, statistics, markets), scientific and technical writings for product information, scientific articles, and further paid data sources.

This study is based on analysis of information obtained continually since 2016 through our research regarding this industry, but updated through the recent months of 2022. During this period, our analysts performs interviews with authoritative and representative individuals in this industry, industry associations, import/export, and other. The interviews were conducted principally with:

  • Manufactuers and their competitors
  • Distributors, wholesaler, and agents
  • Customers
  • CEOs/ Marketing Executives
  • Business Heads
  • Industry Experts
  • Technology and Innovation Directors
  • Senior Managers
  • Program/Project Directors

A full review of published information was also performed to supplement information obtained through interviews. The following sources were reviewed:

  • Professional technical journals and papers
  • Trade press articles
  • Technical conference proceedings
  • Product literature
  • Company profile and financial information
  • Additional information based on previous Global Info Research market studies
  • Personal knowledge of the research team.

Contact US

Global Info Research

E-mail: report@globalinforesearch.com

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