Global Info Research announces the release of the report “Global Alumina DBC (Direct Bond Copper Substrate) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031” . This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share.The report provides an in-depth analysis of the competitive landscape, manufacturer’s profiles,regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global Alumina DBC (Direct Bond Copper Substrate) market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.
According to our (Global Info Research) latest study, the global Alumina DBC (Direct Bond Copper Substrate) market size was valued at US$ 337 million in 2024 and is forecast to a readjusted size of USD 604 million by 2031 with a CAGR of 8.8% during review period.DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
This report studies the Al2O3 DBC ceramic substrate.
In global alumina DBC substrate production market,Europe took the main share(about 41%)，South Korea took 29% share.
The global market is dominated by few players, two of the world"s largest manufacturers occupy for over 60% of global market share in 2019. Rogers/Curamik is the largest producer.
This report is a detailed and comprehensive analysis for global Alumina DBC (Direct Bond Copper Substrate) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Thickness and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
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Market Segmentation
Alumina DBC (Direct Bond Copper Substrate) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Application:IGBT Module、Others
Major players covered: Rogers/Curamik、KCC、Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)、Heraeus Electronics、Nanjing Zhongjiang New Material Science & Technology、NGK Electronics Devices、Littelfuse IXYS、Remtec、Stellar Industries Corp、Tong Hsing (acquired HCS)、Zibo Linzi Yinhe High-Tech Development、BYD、Shengda Tech、Ecocera、Chengdu Wanshida Ceramic Industry
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Alumina DBC (Direct Bond Copper Substrate) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Alumina DBC (Direct Bond Copper Substrate), with price, sales, revenue and global market share of Alumina DBC (Direct Bond Copper Substrate) from 2020 to 2025.
Chapter 3, the Alumina DBC (Direct Bond Copper Substrate) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Alumina DBC (Direct Bond Copper Substrate) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2025.and Alumina DBC (Direct Bond Copper Substrate) market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Alumina DBC (Direct Bond Copper Substrate).
Chapter 14 and 15, to describe Alumina DBC (Direct Bond Copper Substrate) sales channel, distributors, customers, research findings and conclusion.
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